About Us
We are a leading manufacturer specializing in high-density multilayer printed circuit boards and specialty boards. With certifications including UL, ISO9001:2015, ISO14001:2015, CQC, IATF16949:2016, and "National Military Standard," we provide top-quality products and services. Our extensive product range includes multilayer boards, impedance boards, high-frequency boards, high TG thick copper foil boards, 5G high-speed boards, buried blind via boards, aluminum-based boards, hybrid dielectric boards, HDI, rigid-flex boards, specialty boards, and customized solutions.
Driven by technological innovation, our products are widely used in industries such as communication equipment, industrial control, automotive electronics, energy and power, medical devices, IoT, research institutions, aerospace, and defense. With over 19 years of experience, we have served over 1,000 technology innovation-oriented enterprises with rapid prototyping and mass production services. We are committed to delivering cutting-edge solutions and exceeding customer expectations in the dynamic electronics industry.
Manufacturing Capability
| Rigid PCB Manufacturing Capability |
| Category |
Volume Production |
Sample Processing |
Capabilities Detail |
| Layer count |
- |
1-68L |
64 Layer |
| Max thickness |
- |
10mm (394mil) |
14mm (551mil) |
| Min line width/space (Inner) |
2.2mil/2.2mil |
- |
2.0mil/2.0mil |
| Min line width/space (Outer) |
2.5/2.5mil |
- |
2.2/2.2mil |
| Alignment with core board |
±25um |
- |
±20um |
| Inner layer alignment |
±5mil |
- |
±4mil |
| Max copper |
- |
6Oz |
30 oz |
| Holes size (mechanical) |
≥0.15mm (6mil) |
- |
≥0.1mm (4mil) |
| Holes size (laser) |
0.1mm (4mil) |
- |
0.050mm (2mil) |
| Max size (Unit) |
850mm X 570mm |
- |
1000mm X 600mm |
| Max size (Panel) |
1250mm X 570mm |
- |
1320mm X 600mm |
| Aspect ratio (Unit) |
20:1 |
- |
28:1 |
| Aspect ratio (Panel) |
25:1 |
- |
35:1 |
| Material (Lead/Halogen free) |
EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF |
| High-speed material |
Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 |
| High-frequency material |
Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 |
| Other Materials |
Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000 |
| Surface finished |
HAL, HAL-LF, ENIG, IMMERSION TIN, OSP, IMMERSION SILVER, GOLD FINGER, Hard Gold/Soft Gold Plating |
| Special technology |
Blind & buried holes, Via in pad, Semi-plating holes, Counterbore, Step mounting holes, drill Mixed RF PCB, Busbar PCB |
QUALITY ASSURANCE:
Consciousness of making each product a high-quality product by strictly following the quality management system.
Based on ISO 9001, ISO 14001, IATF16949, RoHS, REACH, UL, CQC quality management systems simultaneously running IATF 16949.
Method of involving all staff in the entire process control.
Objective and confidence of ensuring 100% quality.
Shipping acceptance criteria: Customer requirements, IPC standards.
Assisting customers in developing quality standards cooperating with customer experiments to improve product performance.