Explore our premium selection of industrial motherboards, custom PCBAs, memory modules, and processing units built to sustain high-throughput data demands.
From standard office hubs to critical industrial communication buses, modern connectivity demands advanced design, high-frequency signal integrity, and strict thermal dissipation protocols.
As USB4 and Type-C technologies scale up to 40Gbps and 80Gbps, managing insertion loss and impedance matching (typically targeting 90Ω differential impedance) is vital to preventing packet drop and link negotiation failures.
Modern enterprise environments rely on hubs that function as both data bridges and high-wattage power supplies. Supporting PD 3.1 Extended Power Range (EPR) up to 240W requires smart buck-boost regulators and thermal protection systems.
Industrial floors subject USB hubs to severe electrostatic discharge (ESD) and electromagnetic interference (EMI). Integrating compliance standards like IEC 61000-4-2 Level 4 ensures consistent operations in harsh production lines.
A professional technology and PCB manufacturing partner based in Shenzhen, specializing in state-of-the-art DRAM memory solutions, multi-layer PCB design, and robust OEM/ODM services.
Velmix Technology Co., Ltd. is a professional DDR5 memory and electronic assembly manufacturer based in Shenzhen, China, specializing in the research, development, production, and global distribution of high-performance DRAM memory solutions. Since its establishment in 2017, Velmix has been committed to delivering reliable, high-speed memory products and high-frequency PCBA solutions for consumer electronics, industrial applications, gaming systems, servers, and embedded computing.
Operating from a modern manufacturing facility covering 368㎡, we combine advanced production technologies with strict quality management to ensure every memory module and custom USB hub controller PCB meets international performance and reliability standards. Our experienced engineering team continuously develops innovative DDR5 memory and multi-port USB Hub solutions to meet the evolving demands of AI computing, edge devices, cloud infrastructure, and next-generation computing platforms.
Today, Velmix serves customers in more than 40 countries and regions, offering flexible OEM and ODM manufacturing services for global brands, distributors, system integrators, and industrial equipment manufacturers. By focusing on product consistency, fast delivery, and technical innovation, we have built long-term partnerships across Europe, North America, Southeast Asia, and the Middle East.
| Item | Information |
|---|---|
| Company Name | Velmix Technology Co., Ltd. |
| Established | 2017 |
| Facility Area | 368㎡ |
| Annual Export Revenue | USD 18.6 Million |
| Export Experience | 8 Years |
| Industry Experience | 15 Years |
| Quality Control | 100% Full Inspection Before Shipment |
| Product Inspection Methods | Signal Integrity Test, Burn-in Test, Compatibility Test, Functional Test & Random Sampling |
| QC Staff | 56 Employees |
| Business Type | Manufacturer & Exporter |
| Main Markets | North America, Europe, Southeast Asia, Middle East & South America |
| Supply Chain Partners | 986+ |
| Main Customer Types | Brand Owners, OEM Manufacturers, System Integrators, Distributors & Wholesalers |
| R&D Capability | Independent Product Design, PCB Development & Firmware Optimization |
| Customization Options | OEM, ODM, Private Label, Customized Capacity, Heat Spreader, PCB Color & Packaging |
| New Products Launched Last Year | 138 Models |
| R&D Engineers | 84 Engineers |
From industrial schematics to global retail-ready packaging. Our 84 R&D engineers tailor hardware topologies, thermal envelopes, and firmware profiles to align with your project specifications.
Engineering multi-layer PCBs (4 to 12 layers) utilizing high-frequency substrates (e.g., FR4 high TG, Rogers) to ensure zero crosstalk and minimal attenuation on SuperSpeed lines.
Designing custom CNC-milled anodized aluminum enclosures, steel mounts, or DIN-rail systems to survive high vibration, dust, and dynamic industrial environments.
Tailoring controller firmware (such as Realtek, Genesis Logic, or Cypress chipsets) to control current draw, protect downstream ports, and manage dynamic bandwidth allocation.
Subjecting prototypes to rigorous signal integrity validation, thermal imaging, 48-hour continuous burn-in tests, and extensive operating system compatibility matrices.
Whether designing for highly regulated medical theaters, smart automotive arrays, or heavy factories, Velmix develops hardware suited for your ecosystem.
Featuring DIN-rail mounts, industrial wide-temperature component selection (-40°C to +85°C), galvanic isolation, and overcurrent-loop protection for machine-vision cameras and sensor nodes.
Integrating strict medical-grade isolation to safeguard sensitive diagnostics devices against power surges, complying with electromagnetic compatibility constraints for critical patient care.
Robust buck-boost DC-to-DC converters to support unpredictable vehicle battery voltages, wrapped in shock-absorbent housings tailored to automotive temperature indexes.
Detailed architectural insights and common design considerations addressable during the initial OEM/ODM engineering stages.
Our engineering team runs advanced 3D electromagnetic simulators to establish exact PCB trace layouts. We maintain a strict 90Ω differential impedance control and route traces with precision matching to prevent signal reflections and jitter. This is critical when designing multi-port USB 3.2 Gen 2 (10Gbps) or USB4 systems.
By default, we design USB hubs intended for industrial environments to meet IEC 61000-4-2 standards for Electrostatic Discharge Protection (minimum ±15kV air discharge and ±8kV contact discharge). We place low-capacitance TVS diode arrays near all data lanes to clamp transient surges without distorting high-frequency data waveforms.
Yes. Through programmable PD controllers (e.g., Cypress CCG series), we configure smart power-allocation firmware. This allows priority power allocation to specific primary ports, or dynamic distribution of a total power pool (e.g., sharing 100W dynamically across 4 Type-C ports depending on active device states).
We design high-thermal-conductivity PCB layups using multiple ground plane layers, combined with thermal vias to spread heat from high-frequency chips. Enclosures are engineered from anodized aluminum, utilizing custom-profile internal silicone thermal pads to transfer heat directly to the outer chassis casing.
We maintain long-term direct supplier partnerships with top tier controller semiconductor manufacturers, including Realtek, VIA Labs (VLI), and Genesis Logic. Our inventory tracking and component procurement processes (backed by 986+ global supply chain partners) guarantee material availability and price stability.
Each unit undergoes a 100% full inspection protocol. This includes automated optical inspection (AOI), structural functional testing of all upstream/downstream connections, a high-temperature burn-in test under full electrical load, and compatibility checks across Windows, macOS, Linux, and Android systems.
Explore additional high-reliability electronic assemblies, heat sinks, and PCB prototype boards produced inside our Shenzhen facility.