Processor Heat Dissipation LGA2011 Rectangular Server Heat Sink Air-cooled Heat Sink

Product Description

Product Description
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Specification
Type CPU radiator
Texture of material Copper base + copper fins
Heat dissipation method Air cooling
Power waste 95W
Packing & Delivery
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Company Profile

Established in 2006, focusing on electronic consumer/electronic component channels, and specializing in various IC, IT, and electronic accessories. We have established good, stable, and long-term relationships with world-renowned integrated circuit manufacturers and direct customers of integrated circuits. This enables us to have the most advanced technology that surpasses inventory control. All of our DRAM module products play an important role in the OEM market.

FAQ
What materials are used in this CPU radiator?
This radiator features a copper base combined with copper fins to maximize thermal conductivity and ensure highly efficient heat dissipation.
What heat dissipation method does it employ?
It uses an air cooling design that quickly draws heat away from the copper base and releases it through the highly dense copper fins.
What is the maximum power output this radiator can handle?
This CPU radiator is rated for a power waste capacity of up to 95W, making it suitable for a wide range of mainstream desktop processors.
Does this cooler support standard packaging for shipping?
Yes, all units are professionally packed using shock-absorbing materials to ensure they arrive securely and undamaged at their final destination.
Do you handle OEM market orders for these products?
Yes, we have deep channels in electronic components and DRAM modules, playing an active role in providing solutions tailored to OEM market requirements.

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