Engineered for high thermal design power (TDP), precise socket fitment, and continuous uptime in high-density computing clusters.
Ireland, particularly the greater Dublin area (including Grange Castle, Clonee, and Damastown), has cemented its status as the computational heart of Europe. Host to over 80 operational hyperscale and colocation data centers, Ireland manages approximately 25% of all European data traffic. With this concentrated processing power comes a massive thermodynamic challenge: heat dissipation. As multi-socket architectures, AI acceleration hardware, and next-generation Intel Xeon and AMD EPYC platforms push CPU Thermal Design Power (TDP) thresholds beyond 350W, conventional thermal assemblies are falling short.
As a leading server radiator manufacturer and global exporter, we supply the hardware required to keep this massive digital infrastructure operating efficiently. Our custom-engineered heat sinks, liquid cooling blocks, and air-cooled server radiators are built to survive the relentless thermal cycles of modern high-performance computing (HPC) nodes. We bridge the gap between high-volume manufacturing precision and Ireland's strict energy-efficiency mandates.
Ireland’s cool maritime climate offers a significant natural advantage for data center developers, allowing for "free cooling" (direct air heat exchange) for large portions of the year. However, high-density server racks (drawing upwards of 30kW to 100kW per cabinet) demand localized liquid-to-air and liquid-to-liquid heat exchangers. Our advanced server radiators are specifically engineered with:
System integrators and procurement directors operating in Ireland require reliable hardware partners who can guarantee compliance, scaling capabilities, and technical support. Under the overarching umbrella of our manufacturing framework, our facilities leverage deep industry experience (15 years in mechanical thermal design) to engineer custom OEM configurations. By shipping directly to Irish integration hubs, we bypass intermediate distribution markups, ensuring that Tier-1 hyperscale operators receive direct access to advanced cooling blocks.
Years Engineering Experience
Max TDP Heat Dissipation Cap
Helium Pressure & Fluid Leak Testing
Countries Serviced Globally
Understanding the transition path of hardware thermal dissipation as AI workloads demand higher density.
Optimized for legacy setups and edge compute devices. Uses vacuum-sealed copper heat pipes and precision-stacked aluminum fins to achieve up to 220W dissipation in space-constrained rack systems.
Micro-channel copper baseplates designed specifically for LGA4677 and LGA4189 sockets. Engineered to channel liquid coolant directly over the hottest processor dies, managing up to 400W+ workloads.
Adhering to European Green Deal objectives. These radiators integrate seamlessly with facility water loops, minimizing mechanical fan power draw and feeding waste heat directly into local district heating.
To deliver advanced datacenter hardware, thermal mechanics must go hand-in-hand with high-speed memory systems. Operating as a unified hardware engineering manufacturer, Velmix Technology Co., Ltd. integrates specialized DDR5 memory fabrication with next-generation thermal radiator solutions. This holistic engineering approach ensures that high-speed signal pathways and heat dissipation mechanics are designed synchronously for maximum stability.
| Operational Core Area | Technical & Industrial Details |
|---|---|
| Company Name | Velmix Technology Co., Ltd. (Global Thermal & Memory Division) |
| Established & Industry Experience | Founded in 2017 | 15 Years of Thermal & Hardware Design Experience |
| Annual Export Volume | USD 18.6 Million (Serving Ireland, Germany, USA, & Netherlands) |
| Global Inspection Infrastructure | 100% Comprehensive Inspection before export (Helium Leak Test, Thermal Cycles, Signal Compliance) |
| In-house Engineering Team | 84 R&D Engineers specializing in Thermodynamics and PCB Signal Integrity |
| Main Customer Profile | System Integrators, Cloud Service Providers (CSPs), Hyperscalers & OEM Brand Owners |
| Customization Options | Custom fin heights, copper-core baseplates, active PWM fan specs, custom mounting brackets |
| New Product Innovations | 138 custom models launched annually, supporting LGA 4677, SP6, and direct-to-chip liquid cooling block designs |
Choose from our verified server radiator and cold-plate designs, completely compatible with major server architectures.
Addressing key technical, architectural, and supply-chain inquiries from infrastructure directors and hardware engineers.
Inside our high-precision manufacturing, assembly lines, and global logistics terminals supplying Dublin's technology hubs.